1. The laminated structure of the four layer board:
a. TOP, GND02, PWR03, BOTTOM; (The optimal wiring layer is the complete and simplest surface below the TOP layer, and key signals should be prioritized in this layer. The distance between the simplest surface of the power supply and the simplest surface of the ground should not be too thick, and it is best not to exceed 5mil.)
b. TOP, PWR02, GND03, BOTTOM; (This plan is roughly similar to plan a)
c. GND01, S02, S03, GND04/PWR04 (sometimes considered appropriate to achieve a certain shielding effect)
2. The laminated structure of six layer boards
a. TOP, GND02, S03, PWR04, GND05, BOTTOM (This solution is the industry's leading stacked preset solution for 6-layer PCBs, with 3 wiring layers, one for the simplest power supply and two for the simplest ground. The thickness between the 4th and 5th layers should be as small as possible. 3 layers are the best wiring layer, and we advise that signals and high-risk signals should be prioritized in this layer.)
b. TOP, GND02, S03, S04, PWR05, BOTTOM (When there are multiple wiring layers required and the cost requirements are harsh, this scheme can be considered appropriate and used. S03 is the optimal wiring layer in this scheme)
c. TOP, S02, GND03, PWR04, S05, BOTTOM
3. The laminated structure of an eight layer board
a. TOP, GND02, S03, GND04, PWR05, S06, GND07, BOTTOM (industry leading stacking scheme, S03 is the optimal wiring layer)
b. TOP, GND02, S03, PWR1_ 04. GND05, S06, PWR2_ 07. BOTTOM (This solution is attempted to be used in multiple power supply categories, and it is considered appropriate to use a single power supply. The simplest aspect of using a single power supply cannot satisfy the needs of PCB power supply, and the PCB power supply is in a staggered state. The third and sixth layers are the optimal wiring layers)
c. TOP, GND1_ 02, S03, S04, PWR05, GND2_ 07 BOTTOM The decoupling effect of the simplest surface of this stacked structure power supply and the simplest surface of the ground is very poor. It is commonly used in presets with high requirements for wiring layers and strict cost control, such as consumer tablets. The second and sixth layers are better wiring layers. When presetting flat panels, DDR and other high-speed signals are classified based on signal properties and placed in the TOP layer, the third layer, the sixth layer, and the eighth layer. When presetting layers, the distance between the third and fourth layers should be increased Staggered wiring)
4. The laminated structure of ten layers of boards
a. TOP, GND1_ 02, S03, S04, GND2_ 05. PWR06, S07, S08, GND3_ 09. BOTTOM
b. TOP, GND1_ 02, S03, S04, PWR1_ 05. GND2_ 06, S07, S08, PWR2_ 09. BOTTOM (layers 3 and 7 are the optimal wiring layers)
c. TOP, GND1_ 02, S03, GND2_ 04. PWR1_ 05. PWR2_ 06. GND3_ 07, S08, GND4_ 09. BOTTOM (In situations where cost requirements are not high, EMC requirements are high, and dual power supply is the simplest, it is recommended to use this solution as deemed appropriate; layers 3 and 8 are the optimal wiring layers, and the distance between the simplest faces of layers 5 and 6 can be appropriately increased)