PCB AND PCBA CAPABILITIES

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- HOME
- SHOP
- ABOUT US
  Profile
  Certification
  Capability
- PRODUCT
  Single layer pcb
  Double layers pcb
  HDI PCB
  RF PCB
  FLEX PCB
  PCBA
- QUALITY
  Quality control
  Service
  Equipment
- SUPPORT
- CONTACT US

Rely on us to meet your pcb needs
Only focus on making HIGH LEVEL PCB

We are professionally trained CAD/Cam Engineers assure to a seamless transition of customers data to the manufacturing line.The following information with manufacturing capabilities.
PCB Technology Capabilities
Layer1~30L

Min.inner Layer Trace0.076mm

min.inner layer Space0.076mm

Min.outer Layer Trace0.076mm

Min.outer Layer Trace0.076mm

Max.inner layer copper Thickness6oz

Max.outer layer copper Thickness14oz

Layer to Layer registration tolerance <10L+/-0.076mm

Layer to Layer registration tolerance >10L+/-0.125mm

Max.Finished board thickness8mm

Min.Finished board thickness0.3mm

Min.Core Dielectric thickness0.051mm

Min.Impedance-Differential+/-5%

HDI Stack up1+N+1,2+N+2,3+N+3

Controlled Depth Drilling Tolerance+/-0.1mm

AdvancedBuried cpacitor,buried Resistor,Embedded coin,rigid -flex,Rigid- Flex+HDI,Rigid-flex+Metal Base

Max Production Panel Size24.5"*43"

Via in PADYES

BGA Pitch(with trace)0.4mm

Soldermask Registration+/-0.03mm

Min.Solder Dam0.064mm

Min.Drilled Hole size-Mechanical0.2mm

Min.Drilled Hole size-Laser0.1mm

Max.Laser Drill Aspect Ratio20:01

Press Fit Hole+/-0.05mm

Layer To layer Registration Tolerance0.04mm

Min.Dielectric Thickness0.04mm

Controlled Depth DrillingYES

BGA Pitch(with trace)0.5mm

surface Finishing

ENIG,OSP,Immersion tin,immersion silver,HASL,Electrolytic gold

MaterialNormal TG,Middle Tg,High Tg,Halogen free,Low Dk Laminate, High Frequency Laminate,PI Laminate,BT Laminat

PCBA Capability
   MIN Assembly space 0.1mm
   MIN QFP SPACE 0.3MM
   MIN PACKAGE 0201
   MIN/MAX BOARD SIZE 50*50MM - 350*550MM 
   Assembly Registration +/-0.01MM 
   Assembly Sort QFP SOP PLCC BGA .. 
   Assembly capability 1206,0805,0603,0402,0201

PCB Technology Capabilities
Layer	1~30L
Min.inner Layer Trace	0.076mm
min.inner layer Space	0.076mm
Min.outer Layer Trace	0.076mm
Min.outer Layer Trace	0.076mm
Max.inner layer copper Thickness	6oz
Max.outer layer copper Thickness	14oz
Layer to Layer registration tolerance <10L	+/-0.076mm
Layer to Layer registration tolerance >10L	+/-0.125mm
Max.Finished board thickness	8mm
Min.Finished board thickness	0.3mm
Min.Core Dielectric thickness	0.051mm
Min.Impedance-Differential	+/-5%
HDI Stack up	1+N+1,2+N+2,3+N+3
Controlled Depth Drilling Tolerance	+/-0.1mm
Advanced	Buried cpacitor,buried Resistor,Embedded coin,rigid -flex,Rigid- Flex+HDI,Rigid-flex+Metal Base
Max Production Panel Size	24.5"*43"
Via in PAD	YES
BGA Pitch(with trace)	0.4mm
Soldermask Registration	+/-0.03mm
Min.Solder Dam	0.064mm
Min.Drilled Hole size-Mechanical	0.2mm
Min.Drilled Hole size-Laser	0.1mm
Max.Laser Drill Aspect Ratio	20:01
Press Fit Hole	+/-0.05mm
Layer To layer Registration Tolerance	0.04mm
Min.Dielectric Thickness	0.04mm
Controlled Depth Drilling	YES
BGA Pitch(with trace)	0.5mm
surface Finishing	ENIG,OSP,Immersion tin,immersion silver,HASL,Electrolytic gold
Material	Normal TG,Middle Tg,High Tg,Halogen free,Low Dk Laminate, High Frequency Laminate,PI Laminate,BT Laminat

Rely on us to meet your pcb needs

Only focus on making HIGH LEVEL PCB

We are professionally trained CAD/Cam Engineers assure to a seamless transition of customers data to the manufacturing line.The following information with manufacturing capabilities.

PCB Technology Capabilities

PCBA Capability