Double sided pcb
XSJ ELECTRONICS make thousands of different PCB for all different types of applications. Our support extends to the full range of materials and strong technical capabilities.
Qunhui is committed to offering the highest quality printed circuit boards’ at the most competitive pricing. We aim to provide customer excellence on all orders whether you need a simple sample or a time-critical and technologically complex multi-layer printed circuit board product. Our highly specialized team can meet all your PCB needs.
The following are examples of double sided pcb application.
● Industrial controls ● Power supplies
● Consumer Electronics ● LED lighting
● Automotive ● Phone systems
● Control relays ● Hard drives
Double sided PCB
Laminate: FR4 TG130,TG150,TG170,TG180,KB,SHENGYISurface finished: OSP,HAL,HAL LEAD FREE,Chemical Gold, ENIG, Plated gold,Immersion Gold/TIN/Silver,Carbon ink,Peelable,Gold fingerSoldermask：Taiyo (Japan)Dry film: Asahi (Japan), Dupont (US)Min.Hole size: 0.2mm
Min.line Width and Spacing: 0.1mmSurface Finishing
- OSP
- Hot Air Levelling
- Lead Free or Sn/Pb
- Chemical Gold (ENIG – ENIPIG – ASIG)
- Electrolitical Gold
- Chemical Silver
- Chemical Tin
- Carbon Ink
- Peelable Mask
- Gold Fingers (30µ”)
Materials Used
- FR4 Tg 130 TG 150
- KB
- Isola
- NanYa
- ShenYi
- ITEQ
- Rogers
- Teflon
- Halogen Free
- High CTI Material (Max 600V)
Layer counts: 1-24 Layers
Maximum size: 580x1900mm
Material: CEM1, FR1,FR-4,High Tg FR-4,Halogen free,High Frequency(Rogers,Arlon,Taconic,Nelco…), Aluminium base, Copper base
Board outline tolerance: ±0.10mm
Board thickness: 0.1-6.0mm
Thickness tolerance: ( t ≥0.8mm) ±8%
Thickness tolerance: ( t <0.8mm) ±10%
Out layer copper thickness : H oz -20 oz
Inner layer copper thickness: 1/2 oz -10oz
Minimum line/ space: 0.075mm
Minimum finished hole: (mechanical) 0.15mm
Minimum finished hole: (laser) 0.1mm
Aspect ratio:15:1
Impedance control tolerance: ±10%
Bow and twist: Max. 0.7%
HDI PCB stack up: 1+N+1,2+N+2,1+1+N+1+1,3+N+3
Surface Treatment: HASL,HASL Lead Free, ENIG,Immersion Silver,Immersion Tin,Flash Gold,Golden Finger,OSP,Carbon Ink, Peelable Mask.
Microvia & ELIC technology*Notes :Unless otherwise specified, all boards are manufactured under IPC-A-600F class II specifications and guidelines.
