HDI PCB
XSJ ELECTRONICS make thousands of different PCB for all different types of applications. Our support extends to the full range of materials and strong technical capabilities.
HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.
High Density PCB is used extensively in applications and industries including:
● Cell phone ● GPS
● Telecom ● ASemiconductor
● Automotive ● Military
● Medical ● Instrumentation
HDI PCB
Laminate: FR4 KB,SHENGYI TG170 TG180Surface finished:OSP,HAL,HAL LEAD FREE,Chemical Gold, ENIG, Plated gold,Immersion Gold/TIN/Silver,Carbon ink,Peelable,Gold finger
Soldermask：Taiyo (Japan)
Dry film: Asahi (Japan), Dupont (US)
Min.Hole size: 0.1mm
Min.line Width and Spacing: 0.1mm BGAMaterials Used
- FR4 Tg 130-150-170-180-200
- KB
- Isola
- NanYa
- ShenYi
- ITEQ
- Rogers
- Teflon
- Halogen Free
- High CTI Material (Max 600V)
Surface Finishing
- OSP
- Hot Air Levelling
- Lead Free or Sn/Pb
- Chemical Gold (ENIG – ENIPIG – ASIG)
- Electrolitical Gold
- Chemical Silver
- Chemical Tin
- Carbon Ink
- Peelable Mask
- Gold Fingers (30µ”)
Capability
Max layer : 24L
Max board thickness: 2.0mm
Min board thickness 0.8mm(8L)
Min line space/width 0.065/0.065mm
Min hole/pad size 0.1/0.25mm（Blind hole）
Max copper thickness 1.5 oz
Tolerance +/-0.05mm
PTH hole tolerance +/-0.05mm
HDI stack up 3+N+3
*Notes :Unless otherwise specified, all boards are manufactured under IPC-A-600F class II specifications and guidelines.
